TELE-MASTER specialize in the design and production of high-quality printed circuit boards (PCBs)

Our company provides reliable PCB solutions for various industries, emphasizing advanced manufacturing technology, strict quality control, and excellent customer service. TELE-MASTER aims to support clients with competitive lead times and customized designs to meet demanding electronic applications.

PRODUCTION LOCATIONS

1

- SINCE 2000

TAOYUAN FACTORY

2

- SINCE 2023

NEW FACTORY

3

- SINCE 1990

ZHONGLI FACTORY

OUR VALUED CUSTOMERS

CERTIFICATION OF REGISTRATION

We have obtained the following certifications, reflecting our strong commitment to consistent,
reliable, and high-quality production you can fully trust!

UL CERTIFICATION

Certificate Of Compliance

ISO 9001:2015

Quality Management Systems

ISO 45001:2018

Occupational Health And Safety Management Systems

ISO 13485:2016

Medical Devices — Quality Management Systems — Requirements For Regulatory Purposes

IATF 16949

Automotive Quality Management System Standard

TECHNOLOGY CAPABILITY

ITEM	DESCRIPTION
Fine Line/Pitch/Hole	Fine Line L/S: 2/2 Mils. Drilling Pitch: 19.6Mil. Via Hole: 6Mil (Mechanical), Advanced Via Hole: 4 Mils (Mechanical),
High Layer Counts	Min.: Single Max: 26 Layers (Advance: Max: 34 Layers)
Construction	Non-Regular Shapes And Constructions
Panel Size	Max. 24” X 40” (Working Panel)
Finished Board Thickness	Min.: 4Mil (0.1Mm) Max: 126Mil (3.2Mm), Special To 197Mil (6Mm)
Thin Core	Min. 2Mil
Copper Thickness	Min.: 1/4 OZ; Max.: 16 OZ (Outer Layer)
Copper Plating Aspect Ratio	Max.: 1:20
Impedance	+/- 7%
HDI Board	3+N+3 Construction
Material	FR4, FR5,FCCL, (Rogers, Ventec, Nelco, Arlon, Polyimide..) Further Material Request Can Be Done Per Customer Requirement.

SURFACE FINISHED

ITEM	DESCRIPTION	ITEM	DESCRIPTION
HASL / HAL	Available	Immersion Tin	Available
Nickel Plating	Available	Immersion Silver	Available
Gold Plating	Available	OSP	Available
Tin Plating	Available	Selective Gold Plating	Available
Immersion Gold(ENIG)	Available	Gold Finger Plating	Available
Immersion Gold (ENEPIG)	Available

FPC TECHNOLOGY CAPABILITY

ITEM	STANDARD	ENGINEERING	UNIT
Multilayer FPC	2~4 L	6~8 L	Um
Min. Line/Space
Inner Layer	65/65	50/50	Um
Outer Layer	75/75	65/65	Um
Min. Laser Via Diameter	100	75	Um
Min. Laser Land	300	275	Um
Min/Max. Drill Size	150/5000	150/5000	Um
Min. Drill Land	450	425	Um
Trace Shift Between 2 Drill Hole	200	-	Um
PTH Size Tolerance	+/-75	-	Um
PTH Thick	<20	-	Um
OSP (Entek)	25	20	U"Inch
Electrolytic Gold Plating Ni/Ag	120~150/2~3	-	U"Inch
ENIG	120~150/2~3	-	U"Inch
Soldermask Clearance Pad/Dam	75/100	50/75	Um
Silk Spec.	+/-300	-	Um
Silk Tolerance	150	-	Um

QUALITY ASSURANCE

Our engineering staff plays a pivotal role in product development and innovation, ensuring that our manufacturing process adhere to stringent quality standards.

Recognizing that quality is paramount to customer satisfaction, we are deeply committed to rigorous quality control measures and efficient manufacturing practices.

This dedication ensures that our products consistently meet the highest standards before they are introduced to the market.

PCB PRODUCTS

HDI PCB

Material

RO4350/RO4450

Layer	10L
PNL Size	76.2 x 186.69 mm
Cu Thickness	1oz
Board Thickness	1.6 mm, HDI 3+N+3, Blind via Cu filling
Surface Finished	ENIG
Application	Drone

DRONE

SEMICONDUCTOR

PCB PRODUCTS

HDI PCB

Material

RO4350/RO4450

Layer	8L
PNL Size	76.2 x 186.69 mm
Cu Thickness	1oz
Board Thickness	1.6 mm, HDI 3+N+3, Blind via Cu filling
Surface Finished	ENIG
Application	Semiconductor testing board

PCB PRODUCTS

Thin Board PCB

BLOOD ANALYZER

Material

FR370HR

Layer	2 L
Board Thickness	0.2 +/-0.038mm
Line	Width/Space : 5/5 mil Selective Cu Plating Routing Slot 0.5Mm
Surface Finish	OSP + Selective Ni/120u” ,Au 3u”
Application	Blood analyzer

PCB PRODUCTS

Tab PCB

HEARING INSTRUMENT AUDIPHONES

Material

FPC or FR-4 halogen free material

Layer	1L
Board Thickness	0.05~0.127 mm
Pcs Size	about 1.11x 1.5 mm
Surface Finish	Ni/100u” ,Au 2u”
Application	Hearing instrument , Audiphones

PCB PRODUCTS

High Frequency PCB

HI FREQUENCY CONNECTOR

Material

Nelco N4000-13 si

Layer	6L
Board Thickness	1 +/-0.1mm
Line: Width/Space	5/5 mil
Surface Finish	Ni/120u” ,Au 2u”
G/F	Selective Au plating 30u” Blind via for L12 and L56, Buried via for L13 and L46
Impedance Control	100+/-5ohm
Application	Hi frequency connector

PCB PRODUCTS

Metal Core PCB

POWER SUPPLY

Material

Metal Core PCB

Layer	2L+AL2.0mm
PNL Size	4.9 x 8.75 inch
Cu Thickness	2oz
Board Thickness	2.4 mm
Thermal Conductivity	8W / mk
Surface Finish	HASL
Application	Power supply

PCB PRODUCTS

Burn In Board PCB

BURN IN BOARD

Material

Polyimide

Layer	26L
Piece Size	17.7 X 22.6 inch
Board Thickness	3.2 +/-0.25mm
Line: Width/Space	4/4 mil
Surface Finish	Ni/120u” ,Au 2u”
G/F	Au plating 50u”
Drill pitch	0.5 mm
Application	Burn In Board

PCB PRODUCTS

Burn In Board PCB

BURN IN BOARD

Material

Rogers RO4350B & RO4450F

Layer	10L
Board Thickness	2.4+/-0.24mm
Line: Width/Space	5/5 mil
Surface Finish	Ni/120u” ,Au 2u”
G/F	Au plating 50u”
Drill pitch	0.8 mm
Application	Burn In Board